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DAEBPA      Diallylether bisphenol A   CAS No. 3739-67-1

DABPA can be used for high technology of applications, including epoxidised adhesives for semiconductor chips, photoresists, tough impact resistant prepregs, mouldings with high breaking toughness for fibre reinforced structures, composites with high heat water and chemical resistance, coatings with high heat, water and chemical resistance, etc.

Structure

                                                       Molecular weight: 308


Typical Properties

Purity, %:                         93
Specific gravity (25șC):                           1.02
Boiling point, ° C at 1 mm Hg                       156
Solubility in water, %:                         <0.1
Refractive index (25șC):                           1.5674
Appearance: Clear, water white, sirupy liquid

email: sghibartz@bimax.com

Copyright © 1998-2006 Bimax Chemicals Ltd. All rights reserved.
Revised: June 18, 2006.